Analysis of Anodic Bonding and Packaging Effects in Micro Sensors
نویسنده
چکیده
Anodic bonding is quite popular in making microsensors since it can bond sodium-rich glass to silicon or virtually any metals with good adhesion strength in lower temperature. It is well known that this process will introduce thermal strain due to different coefficients of thermal expansion between silicon (or other metal) and glass. Yet its effects have not been well studied. After anodic bonding, either adhesive or solder joint is usually used to attach the bonded sensors to plastics or other materials. The packaging strategy will definitely influence the performance of sensors too. The effects and interactions in the process of anodic bonding and die attachment will be studied in this paper. Models based on finite element method are proposed to describe the relationship among them. The simulation results match experimental results quite well. Based on this model, the major influential factors are also studied systematically.
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